EJOT TSSD®

Specification

Overview
- Fastening element and process specifically for sandwich elements
- Broad application range
- Especially suitable for honeycomb structures
- High transmittable tensile forces
- No corrosion
- Can be used as screw boss or as direct fastening element

Downloads

Slovakian

EJOT_TSSD_Flyer_01.23_en.pdf 270 KB

English

EJOT_TSSD_Flyer_01.23_en.pdf 270 KB

Hotline

Applications Engineer

hotline@ejot.com
+49 2751 529-123

Branislav Gunda

bgunda@ejot.com
+421 903 644 678

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CAD & more

The EJOT TSSD^® thermal adhesive bonding boss

The EJOT^® TSSD (thermal adhesive bonding boss) product and corresponding joining process have been developed with the objective to join components of which one is made of fibre-reinforced plastics.
The process is suitable for sandwich elements with honeycomb and foam core structures (having different top coats) as well as for CRP and GRP plastic materials.
During the joining process the plastic boss (made of thermoplastic) is installed into the plastic component with a certain rotation speed and axial load.

TSSD^® APPLICATION CHECK

For process reliable fastening of components in honeycomb and foam core structures with different cover layers, EJOT has developed the "TSSD" (thermal adhesive bonding boss), an innovative product including joining process. For the TSSD^® joining process, a new online tool is now available, where the user can find standard values which are based on numerous trials.